We are at the forefront of cutting-edge Microfluidics & MEMS technology, delivering next-generation solutions
Aerospace
Pressure Switch
Model-INFPS001
Nominal Size 90x30MM
Pressure Switch
Model-INFPS001
Nominal Size 90x30MM
INFPS001 is an aerospace standard Pressure Switch used in LCA-MK1 with mechanical systems. Precision made, laser welded, stainless steel (SS316L) construction insures long life and high performance over extremely harsh environments. Please contact our engineering team with your exact specification so we can ensure you have selected the correct model.
- Highly reliable and accurate
- Excellent shock and vibration resistance
- Precision beam welded
- Ideal for harsh environments
- No power required for operation
Differential Pressure Switch
Model-INFPS001
Nominal Size 90x30MM
Differential Pressure Swith
MODEL-INFDPS001
NOMINAL SIZE 90X30MM
Our model -INFDPS001 is an aerospace standard differential pressure switch used in LCA-MK1 with mechanical systems and is designed for applications requiring precise monitoring and control of small pressure differences. With a focus on lightweight and robust construction. This product combines the high accuracy and reliability benefits of an aluminum(6061-T6) body. The adjustable set points allow for easy calibration to specific small pressure differential values providing flexibility.
- Highly Reliable and Accurate
- Excellent Shock and Vibration Resistance
- Precision BeamWelded
- Ideal for harsh environments
- No power is required for operation
Pressure Transducer
MODEL-INFPT001
NOMINAL SIZE 90X30MM
Pressure Transducer
MODEL-INFPT001
NOMINAL SIZE 90X30MM
Our model -INFPT001 is an aerospace standard Pressure Transducer used in LCA-MK1 with MEMS-based technology. E-beam welded, stainless steel (SS316L). MEMS – based pressure transducers represent a significant advancement in pressure-sensing technology. Please contact our engineering team with your exact specifications so we can ensure you have selected the correctmodel.
- Highly Reliable and Accurate
- Excellent Shock and Vibration Resistance
- Precision BeamWelded
- Ideal for harsh environments
- High Sensitivity and Accuracy
- Low Power Consumption.
- EMI/EMC Compliance.
Pressure Transducer - high temperature
Model-INFPS001
Nominal Size 90x30MM
High Temperature Pressure Transducer
MODEL-INFHTPT001
NOMINAL SIZE 120X30MM
Our model -INFHTPT001 is an aerospace standard high temperature pressure transducer used in LCA-MK1 with MEMS – based technology and is designed to provide precise pressure measurements in the fluid domain with extreme temperatures. This transducer is ideal for applications where standard pressure sensors would fail due to thermal conditions.
- Highly Reliable and Accurate
- Excellent Shock and Vibration Resistance
- Precision BeamWelded
- Ideal for harsh environments
- High Sensitivity and Accuracy
- Low Power Consumption.
- EMI/EMC Compliance.
Healthcare
MICROFLUIDICS CHIP
Model-INFPS001
Glass Material with Gold Electrode
Microfluidics Chip
MODEL-INFMF001
GLASS MATERIAL WITH GOLD ELECTRODE
We excel in the design and fabrication of advanced microfluidic chips on glass substrates integrated with gold electrodes. Our state-of-the-art facilities and cuttingedge technology enable us to deliver high-precision, reliable, and customizable microfluidic solutions tailored to various applications.
Advanced Fabrication Techniques
- Utilization of photolithography and etching processes to create intricate microfluidic channels on glass substrates.
- Precision deposition of gold electrodes using techniques such as electron beamevaporation and sputtering, ensuring excellent conductivity and durability.
- Capability to support device feature sizes down to 10micrometers (μm), allowing for highly detailed and efficientmicrofluidic designs.
Capability to design and fabricate microfluidic chips tailored to specific requirements, including channel dimensions, electrode patterns, and functional coatings. Scalable production processes that allow for both prototype development and largescale manufacturing, ensuring consistency and quality across batches. Our glass-to-glass bonding capabilities are designed to support the creation of highquality, high-performance microfluidic devices that drive innovation and efficiency across various industries.
MICROFLUIDICS CHIP
MODEL-INFMFP001
PDMS
Microfuidics Chip
MODEL-INFMFP001
PDMS
We specialize in the fabrication of highprecision PDMS (Polydimethylsiloxane) microfluidic chips using advanced silicon moulds.
Our state-of-the-art facilities and expertise enable us to deliver top-quality microfluidic solutions for a range of applications in biomedical research and diagnostics.
Our fabrication process supports the creation of devices with features as small as 10 μm, enabling the development of highly precise and miniaturized microfluidic systems.
We have the capability to integrate gold electrodes within the PDMS chips, facilitating various applications that require electrical interfacing such as electrochemical sensing and cell manipulation.
High-Quality PDMS Casting: We use high-purity PDMS to cast microfluidic chips, ensuring excellent optical transparency and biocompatibility. Our process allows for the replication of intricate features from the silicon mould with high fidelity.
Glass-to-PDMS and PDMS-to-PDMS Bonding: We provide robust bonding capabilities for PDMS chips, including PDMS-to-glass and PDMS-to-PDMS bonding, which are essential for creating durable and leak proof microfluidic devices.