Microfabrication & Cleanroom Facilities
We offer state-of-the-art cleanroom and fabrication facilities purpose-built for precision microfabrication, MEMS prototyping, and microfluidic device development. Our infrastructure supports the full spectrum of wafer-scale processes including lithography, dry and wet etching, wafer bonding, thin film deposition, and inline characterization. Designed to meet both academic and industrial needs, our ISO-compliant labs enable high-resolution patterning, process repeatability, and scalable development — from early R&D through pilot-scale production. Whether you’re developing custom sensors, biochips, or complex microsystems, our facilities provide the tools, processes, and expertise to bring your innovations to life
wet processing
inline characterisation
E-beam Lithography
E-beam lithography is a high-resolution direct-write technique that uses a focused beam of electrons to pattern extremely small features—down to the nanometer scale—on a resist-coated substrate. It is widely used in R&D and prototyping of semiconductor, MEMS, and nanophotonic devices.
Optical Lithography
Optical lithography uses ultraviolet (UV) light to transfer geometric patterns from a photo mask onto a photo resist-coated substrate. It is the most common patterning method in microfabrication, offering high throughput and reliable performance for micron- and submicron-scale features.
Spin Coaters
Spin coaters are used to apply uniform thin films—such as photoresists or polymers—onto flat substrates like silicon wafers. The solution is dispensed onto the center of the wafer and rapidly spun to achieve a controlled thickness across the surface.
Wafer Bonding
Wafer bonding is the process of joining two or more wafers to create multilayer structures. Techniques such as anodic, thermal, or adhesive bonding are employed to support MEMS integration, microfluidics, and complex 3D device fabrication.
ICP-RIE
ICP-RIE is an advanced dry etching technique that uses high-density plasma generated by an inductively coupled source. It allows for anisotropic etching with excellent control over etch depth and sidewall profile. This method is ideal for precision pattern transfer in materials like silicon, polymers, and oxides, making it essential for MEMS and microfluidic device fabrication.
DEEP-RIE
Deep-RIE, often using the Bosch process, enables the fabrication of high-aspect-ratio microstructures by alternating etching and passivation steps. It is particularly used for creating deep trenches, vias, and cavities in silicon substrates for MEMS, TSVs, and microfluidic channels.
Chemical Wet Processing
Chemical wet processing involves the use of liquid chemicals—acids, bases, and solvents—to clean, etch, or modify the surface of semiconductor wafers. It is a foundational step in microfabrication, ensuring particle removal, oxide stripping, and surface preparation before or after lithography and etching processes.
Key Features:
Used for oxide removal, wafer cleaning, and surface prep
Supports RCA cleaning, BOE etching, and solvent stripping
Critical for contamination control and yield enhancement
Bench Acid Clean
Bench acid cleaning uses dedicated wet benches with integrated fume exhaust to perform wafer cleaning using strong acids like H₂SO₄, HCl, and HNO₃. It removes organic, metallic, and particulate contaminants, ensuring surface readiness for further processing.
Key Features:
Performed in ventilated acid-resistant wet benches
Removes organic residues, metal ions, and native oxides
Used before oxidation, lithography, or bonding steps
Chemical Wet Bench
A chemical wet bench is a specialized workstation designed for safely handling acids, bases, and solvents during wet processing. It provides temperature control, chemical flow management, and fume extraction, ensuring both process performance and operator safety.
Key Features:
Constructed from acid-resistant materials (e.g., PP, PVDF)
Includes DI water rinse, spin-dry, and automated dosing (in some models)
Supports multiple wafer sizes and bath chemistries
Acid Metal Etch
Acid metal etching is a selective process using strong acid chemistries (such as HCl or HNO₃ mixtures) to remove metal films (e.g., Al, Cr, Ti) from substrates. It is typically used in pattern transfer or to clear unwanted metal layers post-deposition.
Key Features:
High selectivity to metal films over underlying dielectrics
Used for etching aluminum, chromium, copper, and titanium
Often used after photolithography or lift-off processes
Ellipsometer test
An ellipsometer is a non-destructive optical tool used to measure the thickness and refractive index of thin films with sub-nanometer precision. It works on the principle of polarized light reflection and is essential for monitoring film uniformity, oxide growth, and multilayer coatings in microfabrication.
Key Features:
Measures film thickness (sub-nm to microns)
Provides refractive index (n) and extinction coefficient (k)
Suitable for dielectrics, semiconductors, and organic films
Ideal for quality control in deposition and oxidation processes
KMOS Ultra Scan
KMOS Ultra Scan is a high-resolution surface analysis system capable of mapping wafer bow, warp, and thickness variations across the entire wafer surface. It is especially useful for detecting stress-induced deformations in MEMS or bonded wafers.
Key Features:
Full wafer thickness and topography mapping
Non-contact, high-precision optical metrology
Ideal for bonded wafers, SOI, and thin substrates
Generates detailed bow/warp profiles for yield optimization
Four Point Probe
The four point probe system measures sheet resistance and resistivity of conductive thin films with high accuracy. It uses four collinear contacts to eliminate contact resistance errors and is a go-to method for evaluating doped layers or metal deposition.
Key Features:
High-accuracy resistivity and sheet resistance measurements
Suitable for silicon wafers, ITO, metals, and doped semiconductors
Non-destructive and quick surface analysis
Critical for diffusion, implantation, and metallization steps
Dektak-XT Stylus Profiler
The Dektak-XT is a high-resolution stylus profiler used to measure step heights, surface roughness, and film thickness with sub-nanometer vertical resolution. It is widely used in MEMS, microfluidics, and photolithography process validation.
Key Features:
Measures step height from 5 nm to 1 mm
Sub-nanometer vertical resolution
Captures surface topography and roughness profiles
Useful for photoresist thickness, etch depth, and channel profiles
Microqubic 2D/3D Imaging System
At INFAB Semiconductor, we integrate the Microqubic MRCL Series modular microscope system into our inline characterization and inspection workflow. Designed for high-resolution 2D and 3D optical analysis, it supports a wide range of MEMS, microfluidics, and thin-film applications with unmatched ease of use and flexibility.
Developed by Microqubic AG (Switzerland), this advanced yet compact instrument enables multi-angle imaging, tilt/rotate inspection, and precise surface evaluation without requiring bulky conventional microscope setups.
