Custom MEMS Device Design Application-specific architectures tailored for sensors, actuators, and micro-systems.
Silicon Micromachining Expertise in bulk and surface micromachining for high-precision structures.
Thin-Film Deposition & Etching Advanced techniques such as CVD, PVD, and DRIE to achieve robust and miniaturized components.
Wafer Bonding & Packaging Hermetic sealing, hybrid integration, and packaging solutions optimized for reliability.
Material Versatility Processing across silicon, glass, polymers, and compound semiconductors for diverse application needs.
Prototyping to Production Seamless transition from R&D-scale chips to scalable manufacturing volumes.
Dry Etching
Dry etching involves the removal of material from a substrate using reactive gases or plasma. It offers high anisotropy and resolution, making it ideal for defining fine features in micro- and nano fabrication.
Wet Etching
Wet etching uses liquid chemical solutions to selectively remove materials from a substrate. It is widely used for its simplicity and effectiveness in processing larger surface areas.
Lithography
Lithography is a micro fabrication process used to transfer precise patterns onto a substrate using light-sensitive materials. It forms the basis for defining structures in semiconductor and MEMS device manufacturing.